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选择求职条件领导干法刻蚀模块团队,负责新产品向工厂的转移及高产量制造支持。推动工艺开发与可行性研究,提供集成工艺解决方案,同时管理日常运营、良率提升和制造成本优化。
NMSi has a unique charter to not only deliver high-volume manufacturing products but additionally design and develop Silicon Photonics (SiP), EMIB, and Foveros. NMSI is seeking a Module Group Leader (MGL) for the Dry Etch department (DE).
Leads a team of module engineers and/or manufacturing operations engineers to transfer new products to factory and to support high volume manufacturing in the factory with robust and sustainable solutions and plans and provides resources to meet expectations around safety, quality, output, and affordability/cost while continuously improving team productivity/efficiency.
Leads a team of module development engineers to drive technology development and enablement, provide integrated process solutions, and
perform feasibility studies to meet desired device specifications while maximizing safety, quality, and process capabilities of wafer processing,
assembly/test, and module repair factories.
Provides clear management direction for daily operations and maintenance, process engineering prioritization, yield improvement, and manufacturing efficiency improvement.
Recommends and oversees implementation of modifications for operating equipment to improve production efficiency, manufacturing techniques, and optimizing production output for existing products to meet safety, quality, and cost indicator goals.
Plans for and directs activities in support of process and hardware development enabling manufacturing of innovative device architectures.
Manages and coaches module engineers and manufacturing operations engineers in building technical skills and leadership for the organization to establish right talent for factory ramp.
Facilitates transfer of technology to other sites through training and audit of installation and qualification to ensure matched processing across sites.
Develops long-term strategies for module engineering capabilities to support future requirements.
During factory ramps, ensures resources and processes are in place for the successful install/qualification of Early Tool Sets and ramp production tools.
Responsible for enabling teams to execute through clear goal setting, facilitating work, maintaining accountability, applying differentiated performance management, and driving team results.
Drives results by inspiring people, role modeling Intel values, developing the capabilities of others, and ensuring a productive work environment.
Drives cross organizational alignment towards process pathway solutions.
Deeply partners with integration, device, and yield engineering teams to build robust process solutions that will help deliver to power performance and area leadership with technology structural cost in mind.
Develops long term strategies for module engineering capabilities to support future requirements.
Minimum:
Preferred:
We offer a total compensation package that ranks among the best in the industry. It consists of competitive pay, stock bonuses, and benefit programs which include health, retirement, and vacation. Find out more about the benefits of working at Intel.
Annual Salary Range for jobs which could be performed in the US: $140,830.00-198,820.00 USDThe range displayed on this job posting reflects the minimum and maximum target compensation for the position across all US locations. Within the range, individual pay is determined by work location and additional factors, including job-related skills, experience, and relevant education or training. Your recruiter can share more about the specific compensation range for your preferred location during the hiring process.Work Model for this Role
This role will require an on-site presence. * Job posting details (such as work model, location or time type) are subject to change.*
ADDITIONAL INFORMATION: Intel is committed to Responsible Business Alliance (RBA) compliance and ethical hiring practices. We do not charge any fees during our hiring process. Candidates should never be required to pay recruitment fees, medical examination fees, or any other charges as a condition of employment. If you are asked to pay any fees during our hiring process, please report this immediately to your recruiter.负责领导尖端SoC设计的验证工作,制定仿真、仿真加速及形式化验证策略,确保流片一次成功。指导验证团队,定义可扩展方法论,影响Intel技术方向,弥合微架构规范与硅片实现之间的差距。