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NXP硅可靠性工程师,负责新技术硅可靠性认证策略制定与执行,基于风险评估确保技术可靠性要求符合标准。与设计、测试、系统工程及代工厂合作进行可靠性评估、问题定位和纠正措施,涵盖汽车、IoT和移动领域的FinFET、FDSOI等先进技术。
Your role
Own and execute the silicon reliability qualification strategy for new technologies, based on risk assessment, with clear plans, timely reporting, and issue closure.
Ensure technology reliability requirements are met for internal and foundry technologies by reviewing qualification data and compliance against NXP expectations.
Work with tools, flows, and design teams to implement and validate reliability checks and collateral; assess and address reliability risks and margins in circuits.
Work with product, test, and systems engineering teams to assess product reliability and address issues/risks.
Partner with cross-functional teams to de-risk new technologies/products through reliability assessments, qualifications, and corrective actions.
Key Responsibilities
Define and maintain qualification plans for process/device technologies (tests, sampling, conditions, acceptance criteria), based on risk assessment, and ensure execution to plan.
Participate in design reliability reviews; provide guidance on corrective actions and product stressing/testing.
Drive and track reliability stress testing and data analysis (e.g., intrinsic wear-out mechanisms, latent/extrinsic defects, margin assessment) and issue clear conclusions and reports.
For foundry technologies, review qualification/reliability information provided by the foundry, verify compliance with NXP requirements, and work with the modeling and tools/flows teams to implement and validate reliability checks; identify gaps and drive closure actions.
Lead and participate in cross-functional discussions with technology development, process integration, design engineering, product and test engineering, systems engineering, tools and flows, and quality on reliability, risks, learnings, and required improvements.
Support investigation of reliability-related escapes or anomalies (root-cause, containment, corrective actions) and ensure lessons learned are integrated into future qualification plans.
Ensure documentation is complete, traceable, and available per agreed storage/record expectations for reliability deliverables (reports/presentations as applicable).
Key Interfaces (stakeholders)
Process/Device Integration, Technology Development and Transfer, Design Engineering, Product/Test Engineering, Systems Engineering, Modeling, Failure Analysis, Reliability Test Operations/Life Test Engineering, Quality/PRQE, and external foundry partners.
Your team
The Reliability team is responsible for assessing reliability and delivering collateral for all technologies (Advanced CMOS, High-Voltage and RF) within NXP. We work closely together with design, product, test, and systems teams to successfully launch products made in internal factories as well as external foundries.
We work on leading-edge technologies for applications in the Automotive (Radar, Radio, Infotainment), IoT (Microcontroller), and Mobile (Payment, NFC, UWB), utilizing a wide range of technologies, including FinFET, FDSOI, embedded NVM, high-voltage/analog, and SiGe technologies.
Your profile
To be successful in this role you have:
Furthermore, you are:
科技推广和应用服务业