以上为北京时间。链接检查不代表仍在招聘，申请前请以招聘官网为准。
按这个岗位的城市和方向提醒，确认后才开启，可选择每日或每周。
负责后端封装新工艺开发与实施，改进现有设备及工艺以提升可制造性与稳健性，协调跨部门团队解决工艺集成问题，并与外部供应商合作开发材料改进方案。
To develop and implement new processes for back-end assembly process. To develop new material sets to improve process and material robustness for new and existing packages. To improve existing back-end machines or processes to achieve better manufacturability and robustness for new and existing packages. To prepare evaluation matrix, source evaluation materials, coordinate with assembly to run engineering evaluations. To coordinate cross-functional team to solve process integration failures on the new and existing package. To source and coordinate with external vendors to develop suitable designs for process and material improvement.
Degree in Electrical / Electronic / Mechatronics / Mechanical / Chemical / Material Engineering or a related Engineering discipline. Candidate with more than 2 years' experience in semiconductor industry with similar job responsibilities will be added advantage. Independent and self-motivated with good communication and interpersonal skills. Able to work with all levels of employees and customers.
计算机、通信和其他电子设备制造业
负责Unisem三大厂区的CER和产能分析，深入剖析现有流程，识别瓶颈并制定改进策略，推进流程优化与跨部门项目落地，提升整体运营效率。
