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Technology](/products-technology/) [Die Attach](/products-technology/productgroup/die-attach/) [Hybrid Bonding](/products-technology/productgroup/hybrid-bonding/) [Datacon 8800 CHAMEO ultra plus AC](/products-technology/product-details/product/datacon-8800-chameo-ultra-plus-ac/)
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[Die Bonding](/products-technology/productgroup/die-bonding/) [Esec 2100 hS iXplus](/products-technology/product-details/product/esec-2100-hs-ixplus/)
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[Strip Mapping E142 on Esec Die Bonder](/products-technology/product-details/product/strip-mapping-e142-on-esec-die-bonder/)
[Soft Solder Die Bonding](/products-technology/productgroup/soft-solder-die-bonding/) [Esec 2100 SSI](/products-technology/product-details/product/esec-2100-ssi/)
[Esec 2009 SSI E](/products-technology/product-details/product/esec-2009-ssie/)
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[Flip Chip](/products-technology/productgroup/flip-chip/) [Datacon 8800 FC QUANTUM advanced](/products-technology/product-details/product/datacon-8800-fc-quantum-advanced/)
[Datacon 8800 FC QUANTUM advX](/products-technology/product-details/product/datacon-8800-fc-quantum-advx/)
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[Esec 2100 FC hS](/products-technology/product-details/product/esec-2100-fc-hs/)
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Form](/products-technology/productgroup/trim-form/) [Fico Compact Line - X](/products-technology/product-details/product/fico-compact-line-x/)
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Cleaning](/products-technology/productgroup/plating-cleaning/) [Leadframe wet processing](/products-technology/productgroup/leadframe-wet-processing/) [Meco CDL 1500](/products-technology/product-details/product/meco-cdl-1500/)
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[Chemistry and Tooling](/products-technology/productgroup/chemistry-and-tooling/) [Mecodeflash 100](/products-technology/product-details/product/mecodeflash-100/)
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Products &
Services Besi is a leading manufacturer of assembly equipment supplying a broad portfolio of advanced packaging solutions to the semiconductor and electronics industries. Besi offers customers high levels of accuracy, reliability and throughput at a low cost of ownership in each of leadframe, substrate and wafer level assembly. Our principal product and service offerings are set forth below:
Die Attach Equipment
Single chip, multi chip, multi module, flip chip, thermal compression bonding ("TCB"), fan out wafer level packaging ("FOWLP"), hybrid and embedded bridge die bonding systems and die sorting systems.
Packaging Equipment
Conventional, ultra thin and wafer level molding, trim & form and singulation systems.
Plating Equipment
Tin, copper, precious metal and solar plating systems and related process chemicals.
Service
Tooling, conversion kits and spare parts and other services for its installed base of customers.
Contact Us
BE Semiconductor Industries N.V.
Tel. +31 26 319 4500
[Contact form](/contact-us/contact-form/)
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