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负责镀锡镀镍电镀工艺的维护、优化及新品开发,管理电镀供应商并持续推进零缺陷质量改进。要求化学或材料工程本科及以上学历,3年以上半导体电塑经验,英文流利。
Job Id: HRC1739480
Job Family: Research & Development
Duration of Employment: Permanent
Join as: Professional
Overall responsible for the maintenance, optimization and new product development of tin plating and nickel plating processes, ensuring smooth production and stable processes.
Your role
Key responsibilities in your new role
1.全面负责镀锡镀镍电镀工艺的维护,优化和新品开发,确保生产顺利和工艺稳定 Overall responsible for the maintenance, optimization and new product development of tin plating and nickel plating processes, ensuring smooth production and stable processes
2 . Plating suppliers management by defining smart KPIs and implementation plans
3 . New packages qualification with appropriate process flow for quality assurance
4. Identify the key factors for plating process optimization or continuous improvement with innovative approaches
5. Improve plating process quality towards zero defect and add customer complaints by 8D methodology with plating supplier and internal team
6. Ensuring plating cost efficiency in term of maintenance, materialand human resource
Your profile
Qualifications and skills to help you succeed
1 . Bachelor or Master degree in Chemistry or Material engineering
2 . At least 3 years above experience in Semiconductor Engineering and plating industry
3 . Good communication and interpersonal skills
4 . Master in English skills in terms of speaking, listening and writing
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Our hiring decisions are based on skills and experience. Even if you don't meet every requirement, we encourage you to apply.
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