Equipment Engineering Technician

Position Title:

Electronics Equipment Technician.

Date:

July 2026

Reporting To:

Equipment Engineering Supervisor

Department:

Equipment Engineering

Location:

Bedford, UK

 
I.          BASIC PURPOSE:
 
Performs and co-ordinates the repair of machinery used in semi-conductor processing.
Interfaces with the Equipment Engineering Supervisor, Manufacturing Manager and Plant Manager working alternate early and late shifts to support a 24x7 manufacturing environment.
 

II.         DUTIES AND ACCOUNTABILITIES (End Results Expected):
 

Maintain >80% uptime of key process tools.
Fault find and repair complex machine tool PCBs & to component level.
Provide direction to technician level personnel and provides support/assistance to Manufacturing Shift Leaders and manufacturing support personnel.
To sustain, evaluate and improve uptimes of wafer fab processing equipment.
Communicate with EE Supervisor, Process Engineers and Process Operators.
Identify and implement cost reduction projects.
Maintain a working knowledge of safety policies and regulations to ensure duties of self and others are performed in a safe manner.

III.        INTERPERSONAL SKILLS:
 

Ability to build credibility quickly.
Enthusiasm and aptitude to learn and develop new skills.

A strong team player.
Creative thinker: challenge the old ways and seek/suggest better ways of doing things.

 IV.       COMMUNICATIONS:
 
ORAL:
Excellent verbal skills required to convey work instruction, fault characteristics and diagnosis to all levels of employees, onsite engineering support and OEM tool suppliers.
 
WRITTEN: 
Excellent written skills required to issue work instructions and present ideas, concepts, and solutions to all levels of employees, subcontractors, suppliers via email, memos, graphs, charts, etc.
 
 

  V.       SCHEDULING AND PLANNING:
 
Assists in the Planning and scheduling of assigned project activities.  Involved in short-term and long-range planning activities.
 

 VI.       ANNUAL OPERATING BUDGET:         N/A
                       

VII.       BASIC JOB REQUIREMENTS:
 
EDUCATION:  Minimum HNC/HND from an accredited college or university in Engineering, Science, Mathematics or Material Science, or equivalent education, training and experience.
 
TRAINING AND EXPERIENCE:  Demonstrated ability to perform the above functions, combined with progressive engineering experience and the proven capability to effectively support, sustain and drive forward Continuous Improvement initiatives.
 
SPECIFIC KNOWLEDGE AND EXPERIENCE:
 

Knowledge of wafer fab processes within the semiconductor or cleanroom environment industry preferred.

Can diagnose and repair PCBs to component level.
Excellent problem-solving skills.
Electronics background with ability to fault find within the tools to component level.
Experienced in the repair of Epitaxy, Ion implant and Passivation process equipment an advantage but not essential.
Ability to document processes and procedures to ensure information is retained and shared.
Experience of working effectively with equipment suppliers, subcontractors and service engineers.
Prior experience of 6s / Kaizen preferred.
Proven track record of fixing complex machines.
Capable and prepared to carry out mechanical setup and maintenance tasks.

Prepared to work with tools that contain acids, following safety procedures when replacing valves and pumps involved in the dispense of chemicals.

 
 
OTHER SKILLS:
 

Excellent time management and organizational skills. 
Capable of managing own work and deliverables with little supervision. 
Detail oriented.
Performs well under pressure.
Flexible and able to work in a demanding environment, working alternate early and late shift.
Good level of computer literacy.